Product Introduction

Yeast dryer uses indirect conduction heating to heat the material and vaporize the water, using steam heating, the core technology is temperature control, which avoids killing the beneficial components in yeast. This yeast dryer drying cylinder using high-grade iron manufacturing, with anti-corrosion, non-pollution and other characteristics. The mainframe of the equipment is composed of a dryer, a rack, a transmission system, a scraper device, a limiting material, a scraping device, a dipping device and a steam circuit system. In addition, it is equipped with electrical control cabinets and exhaust hood.

The main factors affecting the yeast dryer can be divided into:

(1) Steam pressure (0.1-0.4Mpa) or heating medium temperature;
(2) Speed (4~10r/min)
(3) Film thickness (that is, the thickness of the material attached to the surface of the dryer)
(4) Material characteristics (such as solids content, fluidity and temperature, etc.)

Yeast Dryer Working Principle

Dongding yeast dryer uses steam as a heat source. First of all, the yeast raw materials to be dried into the preheating tank, preheating to about 50℃, and then by the feed pump into the lower part of the dryer tank, the dryer immersed in about 60-80mm, into the steam pressure is 0.15-0.3Mpa, dried materials is scraped off and then landed at the outlet for collection. The drying degree of the material is controlled by adjusting the pressure of the steam and the speed of the dryer. The condensate in the dryer is discharged from the condensate outlet device.

Yeast Dryer Characteristics

1.The biological activity of the material after drying is guaranteed by using low temperature and fast drying process.
2.The technical design of dryer equipment takes full account of the thermal sensitivity of beer yeast, directly dries the waste yeast liquid of beer, and recovers the maximum recovery amount of single-cell yeast.
3.The contact parts of equipment and material using high-standard cast iron manufacturing, with anti-corrosion, non-polluting.
4.Conduction heating, minimum heat loss , high thermal utilization, less energy consumption.
5.Compact structure, small floor surface, simple operation and maintenance.